Описание
1. MATERIAL:
A. PIN:BERYLLIUM COPPER
B.INSULATOR: 30% GLASS-FILLED THERMOPLASTIC LCP OR EQUIVALENT
UL94V-O,BLACK.
2. FINISH: CONTACT:GOLD FLASH(1°MIN.)ALL OVER,50-100 MICROINCH
1.27-2.54 MICRON) NICKEL UNDERPLATED ALL OVER
SOLER TAB:50-100(1.27-2.54 MICRON) MICROINCH MATTE TIN,
10-100 MICROINCH(1.27-2.54 MICRON) NICK UDERPLATED
3. ELECTRICAL SPECIFICATIONS:
VOLTAGE RATING:250 VAC MIN
CURRENT RATING:2.0 A MIN
DIELECTRIC STRENGTH:1000 VAC FOR I MINUTE MIN
INSULATION RESISTANCE:1000 MEG OHM MIN
CONTACT RESISTANCE:30 MILL.OHM MAX
OPERATION TEMPERATURE:-55°C TO +125°C
PRODUCT WITHSTANDING REFLOW SOLDERING 260° FOR 10S
4. MECHANICAL SPECIFICATIONS:
4.1 DURABILIRY:5.000 CYCLES
4.2 NOTMAL FORCE AT MATED POSITION:60g MIN
4.3 NOTMAL FORCE AT FULL STOKE:100g MIN
5. PARTS TO BT PACKAGED IN ANTI-STATIC TAPE AND REEL
FOR AUTOMATIC PLACEMENT.
6.THE CAVITY## IS 0.8±0.10mm HIGH WITH 0.10±0.10mm RECESSED
FROM SURFACE.
7.CP is critical parameter,supplier must demonstrate minimum
CPK of 1.6 where applicable.
