Описание
0.4mm Board to Board male connector mating Height=1.00mm
Specifications:
1.Materlal:
1-1.Molded portion:LCP resin(ul94-0).
1-2.Contact and post:copper alloy.
2.Surface treatment:
2-1.Terminal portion;base;Ni plating surface;
Au plating(except the terminal tips);exposed nickel portions.
2-2.Metal Clips :base;Ni plating surface;Au flash plating
except the terminal tips)or base;Ni plating surface;
Sn flash plating (except the terminal tips)
3.Characteristics:
3-1.Rated voltage:60V AC/DC
3-2.Rated curren:0.3A/contact(Max.5A at total contact)
3.3.Insulation resistance:Min.1000MΩ(initial)
3.4.Breakdown voltage:150V AC fou 1 min.
3-5.Saltwater spray resistance(header and socket mated:24 hours,
insulact resistance max.90mΩ.
3-6Contact resistance:Max.90mΩ.
3-7.Ambient temperature:-55℃~+85℃.
3-8.Storage temperature:-55℃~+88℃(product only);
40℃~+50℃(emboss packing).
3-9.Composite insertion force:Max.0.918N/contacts X contacts(initial).
3-10.Composite removal force:Min.0.165N/contacts X contacts.
3-11.Post holding force:Min.0.49N/contacts.
3-12.Insertion and removal life:50times.
