Описание
There is little dead space as metal is not exposed on the back of the connector. Thus, it is possible to form wiring patterns on the substrate area which is positioned between the terminals, realizing a suitable structure for high-density packaging.SPECIFICATIONS:
Current Rating:0.5A
Voltage Rating:50V AC/DC
Withstanding voltage:150V AC Ong minute
Contact Resistance:50milliohm Max
Insulation Resistance:100Megohm Min
Operation Temperature:-20°C to +105°C
Insulator:LCP (UL94V-0) Black
Contact Material:Phosphor Btonze
Contact plating:Au or Sn over Ni
