Описание
2.00mm Right Angle DIP Wafer PAD
Specifications:
Current Rating：3A AC.DC
Voltage Rating：100V AC.DC
Withstanding Voltage：800V AC/minute
Insulation Resistance:1000MΩ Min
Contact Resistance：10mΩMax
After Environmental Testing:≤20mΩ
Temperature Range:-25°C-+85°C
Wafer
Material：PA66,UL94V-0
Material PIN:Brass TIN Plated
